At present, the most practical processing method for ceramic materials is to use coarse abrasive grinding tools (mainly diamond grinding wheels) for rough grinding, fine grinding, grinding and polishing. Brittle fracture and plastic deformation are the main removal mechanisms of engineering ceramic materials. The following mainly introduces the advanced grinding technology of engineering ceramic materials in recent years.
　　1.Elid mirror grinding technology:
　　The elid technology can solve the problem that the surface of the grinding wheel is easily blocked when the metal bond super-hard abrasive micro-grinding wheel is ground, thereby ensuring that the grinding wheel always maintains a sharp state during the grinding process. This technology can perform high-efficiency mirror grinding of engineering structural ceramics with a surface roughness ra of less than 10 nm. Therefore, the elid mirror grinding technology can partially replace the traditional grinding and polishing process, and the technology is simple and easy to implement, and plays a role in the manufacture of large and super large structural ceramic parts and the nano-scale surface of the ceramic substrate of the electronics industry.
　　2.Ductile domain grinding method：
　　Due to the large brittleness of structural ceramic materials, it is easy to produce grinding cracks during precision machining. This is contraindicated for aerospace and aerospace parts, such as structural ceramics used in cutting-edge products such as aircraft engines and space rockets. In recent years, countries all over the world are competing to develop new methods for efficient processing of structural ceramic materials without damage. The most effective technique for achieving structural damage-free ceramics is ductile domain grinding. Ductile-domain grinding is a nano-scale grinding technology that uses a high-stiffness, high-resolution grinding machine to remove brittle materials in a ductile domain mode by controlling the depth of the grinding (controlled at tens or several nanometers). That is, the grinding machine of the brittle material causes the brittle fracture to become a plastic flow. However, in order to achieve ductility grinding, certain conditions must be met, which makes the ductile grinding method costly and inefficient. In order to prevent vibration and interference, the spindle rigidity of the machine tool and the machine-grinding system are very high, and a high-resolution micro-feed mechanism is required.
　　3.Ultra high speed grinding technology：
　　Ultra-high-speed grinding technology generally refers to high-speed grinding with a grinding wheel speed of ≥150 ms. According to the calculation formula of the maximum thickness of the undeformed cutting of a single abrasive cutting edge, when the linear velocity of the grinding wheel is increased, the number of abrasive grains involved in cutting per unit time increases, and each abrasive grain is cut under the condition that the other parameters are kept unchanged. The grinding thickness becomes smaller, and the grinding force per mushroom is reduced, and the total grinding force is also greatly reduced. At the same time, the thickness of the single abrasive grinding becomes smaller, which improves the durability of the grinding wheel and reduces the roughness of the grinding surface. In addition, if the grinding wheel grinding thickness is kept constant by adjusting the parameters, the amount of grinding per unit time can be increased and the productivity can be improved while being increased.
　　4.Ultrasonic vibration grinding technology：
　　A large number of researches and experiments at home and abroad have shown that the introduction of ultrasonic vibration in ceramic processing can not only greatly improve the grinding efficiency, but also effectively improve the surface quality of ceramic grinding.