At present, the most practical processing method for ceramics materials is rough grinding with super-hard abrasive tools (mainly diamond wheels). , Fine grinding and grinding and polishing. Brittle fracture and plastic deformation are the main removal mechanisms of engineering ceramics materials. The following mainly introduces the advanced grinding processing technology of engineering ceramic materials in recent years.
1.elid mirror grinding technology:
Using elid technology can solve the problem that the surface of the grinding wheel is easily clogged when grinding the super-abrasive metal powder grinding wheel with metal bonding agent, thereby ensuring that the grinding wheel always maintains a sharp state during the grinding process. This technology can efficiently perform mirror grinding of engineering structural ceramics, and its surface roughness ra value is less than 10 nm in water. Therefore, elid mirror grinding technology can partially replace the traditional grinding and polishing process, and the technology is simple and easy to implement. It plays a role in the manufacture of large and ultra-large structural ceramic parts and the nanoscale surface of ceramic substrates in the electronics industry.
2. Ductile field grinding method:
Due to the brittleness of structural ceramic materials, grinding cracks are easily generated during precision machining. This is forbidden for aerospace and aerospace parts, such as structural ceramics used in cutting-edge products such as aircraft engines and space rockets. In recent years, countries around the world have been competing to develop new methods for efficient and non-destructive processing of the surface of structural ceramic materials. The most effective technology to achieve damage-free machining of structural ceramics is ductile domain grinding. Ductility domain grinding is a nano-level grinding technology. This technology mainly uses high-rigidity and high-resolution grinding machines. By controlling the grinding depth (controlled at tens or several nanometers), brittle materials are removed in the ductile domain mode. That is, the grinding machine of a brittle material causes plastic flow due to brittle fracture. However, to achieve ductile domain grinding, certain conditions must be met, which makes the ductile domain grinding process costly and inefficient. In order to prevent vibration and interference, high requirements are imposed on the rigidity of the machine tool spindle and the machine-grind wheel system, and a high-resolution micro-feed mechanism is also required.
3. Ultra-high-speed grinding technology:
Ultra-high-speed grinding technology generally refers to high-speed grinding with a wheel speed of ≥150 ms. According to the formula for calculating the maximum thickness of undeformed cutting of a single abrasive grain cutting edge, while keeping other parameters unchanged, when the linear speed of the grinding wheel increases, the number of abrasive grains involved in cutting increases in a unit time, and each abrasive grain is cut off. The smaller the grinding thickness is, the smaller the grinding force per mushroom is, and the total grinding force is greatly reduced. At the same time, the smaller grinding thickness of a single abrasive particle can increase the durability of the grinding wheel and reduce the roughness of the grinding surface. In addition, if the cutting thickness of the grinding wheel is kept constant by adjusting the parameters, the amount of grinding per unit time can be increased at the same time as the productivity is improved.
4. Ultrasonic vibration grinding technology:
的 A lot of research and experiments at home and abroad show that the introduction of ultrasonic vibration in ceramic processing can not only greatly improve the grinding efficiency, but also effectively improve the surface quality of ceramic grinding.